Manufacturing method of display substrate

Provided is a production method for display substrates which includes: a step in which a resin composition including (a) a polyimide precursor, (b) an alkoxysilane compound, and (c) an organic solvent is applied to a support and heated to form a polyimide resin film; a step in which a semiconductor...

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Bibliographische Detailangaben
Hauptverfasser:	ARAKAWA, YUMIKO, OOE, MASAYUKI, UEDA, ATUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a production method for display substrates which includes: a step in which a resin composition including (a) a polyimide precursor, (b) an alkoxysilane compound, and (c) an organic solvent is applied to a support and heated to form a polyimide resin film; a step in which a semiconductor element is formed on the polyimide film; and a step in which the polyimide film having the semiconductor element formed thereon is peeled from the support.