TWI623567B

The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the follow...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KURITA, TOMOHARU, TADA, KENTA
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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