TWI623567B

The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the follow...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KURITA, TOMOHARU, TADA, KENTA
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the following general formula (1) (in formula (1), R1 represents a compound having a specific structure, R2 represents a divalent linear aliphatic group, a divalent cyclic aliphatic group or a divalent aromatic group).