TWI623567B
The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the follow...
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| creator | KURITA, TOMOHARU TADA, KENTA |
| description | The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the following general formula (1) (in formula (1), R1 represents a compound having a specific structure, R2 represents a divalent linear aliphatic group, a divalent cyclic aliphatic group or a divalent aromatic group). |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI623567BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI623567BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI623567BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfc0MzI2NTN34mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC5EbiA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI623567B</title><source>esp@cenet</source><creator>KURITA, TOMOHARU ; TADA, KENTA</creator><creatorcontrib>KURITA, TOMOHARU ; TADA, KENTA</creatorcontrib><description>The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the following general formula (1) (in formula (1), R1 represents a compound having a specific structure, R2 represents a divalent linear aliphatic group, a divalent cyclic aliphatic group or a divalent aromatic group).</description><language>chi</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180511&DB=EPODOC&CC=TW&NR=I623567B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180511&DB=EPODOC&CC=TW&NR=I623567B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KURITA, TOMOHARU</creatorcontrib><creatorcontrib>TADA, KENTA</creatorcontrib><title>TWI623567B</title><description>The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the following general formula (1) (in formula (1), R1 represents a compound having a specific structure, R2 represents a divalent linear aliphatic group, a divalent cyclic aliphatic group or a divalent aromatic group).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0MzI2NTN34mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC5EbiA</recordid><startdate>20180511</startdate><enddate>20180511</enddate><creator>KURITA, TOMOHARU</creator><creator>TADA, KENTA</creator><scope>EVB</scope></search><sort><creationdate>20180511</creationdate><title>TWI623567B</title><author>KURITA, TOMOHARU ; TADA, KENTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI623567BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KURITA, TOMOHARU</creatorcontrib><creatorcontrib>TADA, KENTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KURITA, TOMOHARU</au><au>TADA, KENTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI623567B</title><date>2018-05-11</date><risdate>2018</risdate><abstract>The present invention provides a polyimide resin composition that has excellent heat-resistance, flexibility and low moisture absorption, and a film fabricated by using the same. The present invention also provides a polyimide resin which is characterized by a constituting unit comprising the following general formula (1) (in formula (1), R1 represents a compound having a specific structure, R2 represents a divalent linear aliphatic group, a divalent cyclic aliphatic group or a divalent aromatic group).</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | TWI623567B |
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