TWI623378B

TWI623378B

PROBLEM TO BE SOLVED: To provide a polishing device in which a polishing body is supported by a head through an elastic mechanism, and which can prevent overshoot to a target load in polishing which occurs when switching from position control to load control.SOLUTION: A polishing device includes a h...

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Bibliographische Detailangaben
Hauptverfasser: OMAGARI, HIROAKI, MUROFUSHI, YU, TOMIYASU, MASATERU
Format: Patent
Sprache:chi
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polishing device in which a polishing body is supported by a head through an elastic mechanism, and which can prevent overshoot to a target load in polishing which occurs when switching from position control to load control.SOLUTION: A polishing device includes a holding part for holding a polished material, a polishing body 10 for polishing the polished material, a head 30 for supporting the polishing body 10 through an elastic mechanism 32, a drive mechanism for moving the head 30 in a Z coordinate direction, a control part for controlling the drive mechanism, and a position sensor 34 for measuring a position of the polishing body 10 relative to the head 30. Load control is carried out based on a measurement value of the position sensor 34 and a spring constant of the elastic mechanism 32.SELECTED DRAWING: Figure 2