TWI623154B

A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductiv...

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Bibliographische Detailangaben
Hauptverfasser: HOYT, JUSTIN, MENDOZA, JERBER, DEICHMANN, ERIC A, TILLOTSON, DANIEL, FLYNN, MICHAEL P, LONG, JERRY A
Format: Patent
Sprache:chi
Schlagworte:
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Zusammenfassung:A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.