Composition for forming silica layer, method for manufacturing silica layer, silica layer, and electronic device

A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.

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Bibliographische Detailangaben
Hauptverfasser:	SEO, JINWOO, KIM, JINGYO, JANG, JUNYOUNG, LEE, EUNSEON, NA, YOONG HEE, YUN, HUICHAN, KWAK, TAEKSOO, BAE, JIN-HEE, KIM, HANEUL, HWANG, BYEONGGYU, NOH, KUNBAE, KIM, WOO HAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.