Insulating resin composition for printed circuit board and products using the same

The present invention provides an insulaton resin composition for a printed circuit board, a prepreg, a copper clad laminate, and a printed circuit board which are manufactured by using the same composition. More specifically, according to an embodiment of the present invention, a curing agent inclu...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JIN YOUNG, MOON, JIN SEOK, LEE, HYUN JUN, YUN, GEUM HEE, JO, DAE HUI, YOO, SEONG HYUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides an insulaton resin composition for a printed circuit board, a prepreg, a copper clad laminate, and a printed circuit board which are manufactured by using the same composition. More specifically, according to an embodiment of the present invention, a curing agent including a bipyridine structure is included in the insulaton resin composition. Therefore, heat-resistant properties, including the glass transition temperature and a coefficient of thermal expansion, and mechanical properties, including separation strength between a metal layer and an insulation layer, are increased.