Electronic package and the manufacture thereof

Electronic package and the manufacture thereof

An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure dispose...

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Hauptverfasser: CHEN, YAN HENG, CHIANG, CHENG CHIA
Format: Patent
Sprache:chi ; eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHEN, YAN HENG
CHIANG, CHENG CHIA
description An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure disposed on the packaging layer, the surface area of the antenna structure is increased by the design thatthe antenna structure has a recess portion, thereby increasing the antenna gain.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI620278BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI620278BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI620278BB3</originalsourceid><addsrcrecordid>eNrjZNBzzUlNLinKz8tMVihITM5OTE9VSMxLUSjJSFXITcwrTUtMLiktSgXxi1Lz03gYWNMSc4pTeaE0N4OCm2uIs4duakF-fGox0ITUvNSS-JBwTzMjAyNzCycnYyKUAACw6Cqh</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic package and the manufacture thereof</title><source>esp@cenet</source><creator>CHEN, YAN HENG ; CHIANG, CHENG CHIA</creator><creatorcontrib>CHEN, YAN HENG ; CHIANG, CHENG CHIA</creatorcontrib><description>An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure disposed on the packaging layer, the surface area of the antenna structure is increased by the design thatthe antenna structure has a recess portion, thereby increasing the antenna gain.</description><language>chi ; eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180401&amp;DB=EPODOC&amp;CC=TW&amp;NR=I620278B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180401&amp;DB=EPODOC&amp;CC=TW&amp;NR=I620278B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN, YAN HENG</creatorcontrib><creatorcontrib>CHIANG, CHENG CHIA</creatorcontrib><title>Electronic package and the manufacture thereof</title><description>An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure disposed on the packaging layer, the surface area of the antenna structure is increased by the design thatthe antenna structure has a recess portion, thereby increasing the antenna gain.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzzUlNLinKz8tMVihITM5OTE9VSMxLUSjJSFXITcwrTUtMLiktSgXxi1Lz03gYWNMSc4pTeaE0N4OCm2uIs4duakF-fGox0ITUvNSS-JBwTzMjAyNzCycnYyKUAACw6Cqh</recordid><startdate>20180401</startdate><enddate>20180401</enddate><creator>CHEN, YAN HENG</creator><creator>CHIANG, CHENG CHIA</creator><scope>EVB</scope></search><sort><creationdate>20180401</creationdate><title>Electronic package and the manufacture thereof</title><author>CHEN, YAN HENG ; CHIANG, CHENG CHIA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI620278BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN, YAN HENG</creatorcontrib><creatorcontrib>CHIANG, CHENG CHIA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN, YAN HENG</au><au>CHIANG, CHENG CHIA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic package and the manufacture thereof</title><date>2018-04-01</date><risdate>2018</risdate><abstract>An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure disposed on the packaging layer, the surface area of the antenna structure is increased by the design thatthe antenna structure has a recess portion, thereby increasing the antenna gain.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
recordid cdi_epo_espacenet_TWI620278BB
source esp@cenet
subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Electronic package and the manufacture thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T20%3A43%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN,%20YAN%20HENG&rft.date=2018-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI620278BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true