Electronic package and the manufacture thereof

Electronic package and the manufacture thereof

An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure dispose...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN, YAN HENG, CHIANG, CHENG CHIA
Format: Patent
Sprache:chi ; eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package and a manufacturing method thereof, the electronic package comprising: a substrate, an electronic component and a conducting post which are disposed on the substrate, a packaginglayer for coating the electronic component and the conducting post, and an antenna structure disposed on the packaging layer, the surface area of the antenna structure is increased by the design thatthe antenna structure has a recess portion, thereby increasing the antenna gain.