Thin film deposition apparatus and method of depositing thin film using the same

A thin film deposition apparatus includes a mask in contact with a first surface of a substrate, a magnet plate above a second surface of the substrate and configured to pull the mask toward the first surface of the substrate, the second surface being an opposite surface to the first surface, and an...

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Bibliographische Detailangaben
1. Verfasser:	LEE, JAEOL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A thin film deposition apparatus includes a mask in contact with a first surface of a substrate, a magnet plate above a second surface of the substrate and configured to pull the mask toward the first surface of the substrate, the second surface being an opposite surface to the first surface, and an insulating member between the magnet plate and the second surface of the substrate.