TWI619189B

PROBLEM TO BE SOLVED: To provide a substrate processing device which is advantageous for improvement of throughput and reduction in an installation area.SOLUTION: A substrate processing device 1 includes: a processing part P for processing a first surface S1 and a second surface S2 of a substrate SU...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIHARA, MASAHITO, YAMADA, TAMIO, MATSUKI, NOBUO, IMAI, KOMEI, NOZAWA, NAOYUKI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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