TWI619189B

PROBLEM TO BE SOLVED: To provide a substrate processing device which is advantageous for improvement of throughput and reduction in an installation area.SOLUTION: A substrate processing device 1 includes: a processing part P for processing a first surface S1 and a second surface S2 of a substrate SUB; a temperature control part TA for adjusting the temperature of the substrate SUB; a drive part DR for moving the temperature control part TA; and a conveyance part CNV for conveying the substrate SUB. The processing of the first surface S1 of the substrate SUB by the processing part P is performed at a first position P1, and the processing of the second surface S2 of the substrate SUB is performed at a second position P2. After the first surface S1 is processed at the first position P1, in order to process the second surface S2 in the second position P2, the conveyance part CNV conveys the substrate SUB from the first position P1 to the second position P2 along a conveyance path, and when the conveyance part CNV