Conductive composition

Disclosed is a conductive composition useful for the preparation of electrically conductive structures on a substrate comprising a plurality of metal particles, a plurality of glass particles and a vehicle comprising at least one cellulose derivative and at least one solid organopolysiloxane resin dissolved in a mutual organic solvent. The solid organopolysiloxane resin acts as adhesion promoter and assists in stably dispersing the metal and glass particles to avoid an agglomeration of such particles without degrading the rheological properties. From such conductive compositions uniform well adherent electrically conductive structures essentially free from defects in the form of cracks, bubbles or coarse particulates can be prepared on dielectric or semiconductor substrates such as silicon wafers in an efficient and cost-saving manner e.g. by screen printing, drying and sintering while inducing only low warping of the substrate. These characteristics render said conductive compositions particularly useful for