Substrate with solder and method of manufacturing the same

A substrate with a brazing material comprises a substrate body and the brazing material at least containing Ag and Cu and formed on the substrate body. In the brazing material, a surface vicinity area where the containing mass ratio of Ag relative to the total of Ag and Cu is above 0.95 is 1.3 micro...

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Bibliographische Detailangaben
Hauptverfasser:	ASADA, KEN, NISHINA, JUNYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A substrate with a brazing material comprises a substrate body and the brazing material at least containing Ag and Cu and formed on the substrate body. In the brazing material, a surface vicinity area where the containing mass ratio of Ag relative to the total of Ag and Cu is above 0.95 is 1.3 microns or more than 1.3 microns deep in the depth direction from the surface of the brazing material.