MOLD AND THERMOFORMING PROCESS USING THE SAME
The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decom...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decomposition temperature of the male mold. The male mold starts decomposition when the temperature equals to the thermal decomposition of the male mode. The curing temperature of thermosetting material is lower than or equal to the thermal decomposition starting temperature of the male mode. The femalemode is in the rigid state when the temperature is lower than the softening temperature of the female mode. The softening temperature of the female mode is higher than the thermal decomposition temperature of the male mode. According to the invention, a work piece and a thermal decomposition male mode are formed by the aid of the curing presoaking material overlapping layer. The work piece can beremoved easily since the m |
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