TWI605502B

Provided is an adhesive tape for protecting surfaces of semiconductor wafers, which is capable of suppressing kerf shift in a pre-dicing method and a pre-stealth method and which can be peeled off without damaging or contaminating the semiconductor wafers. An adhesive tape 1 for protecting surfaces of semiconductor wafers according to the present invention is characterized by comprising: a base resin film 2; and an adhesive layer 4 formed on at least one side of the base resin film 2, wherein the base resin film 2 includes at least one rigid layer having a tensile modulus of elasticity of 1 to 10 GPa, and the adhesive tape 1 has a peeling force of 0.1 to 3.0 N/25 mm at a peeling angle of 30 degrees after being radiation-cured when the adhesive layer 4 is of a radiation-curable type and after being heated up to 50 DEG C when the adhesive layer 4 is of a pressure-sensitive type.