Vacuum vapor deposition device and vacuum vapor deposition method

PROBLEM TO BE SOLVED: To provide a vacuum evaporation apparatus which capable of increasing uniformity of the total thickness of an organic EL film.SOLUTION: A vacuum evaporation apparatus includes: a guide path to transport evaporation material obtained in an evaporation source; and a discharge mem...

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Bibliographische Detailangaben
1. Verfasser:	DAIKU, HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a vacuum evaporation apparatus which capable of increasing uniformity of the total thickness of an organic EL film.SOLUTION: A vacuum evaporation apparatus includes: a guide path to transport evaporation material obtained in an evaporation source; and a discharge member which discharges the evaporation material flowing from the guide path into a vapor-deposited member. The discharge member includes: a dispersion vessel 7 for diffusing the evaporation material; and multiple nozzle members 8 each of which is protrusively provided toward the vapor-deposited member, and has a diaphragm opening for discharging the evaporation material to the vapor-deposited member. Each nozzle member 8 satisfies relational expressions: L9D and D'2.7D/L, or L