Liquid epoxy resin composition

The purpose of the present invention is to provide a liquid epoxy resin composition which exhibits good fluidity even if an inorganic filler is contained therein and has a long pot life by being suppressed in increase in viscosity during storage. A liquid epoxy resin composition which is characteriz...

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Bibliographische Detailangaben
1. Verfasser:	HOSONO, YOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a liquid epoxy resin composition which exhibits good fluidity even if an inorganic filler is contained therein and has a long pot life by being suppressed in increase in viscosity during storage. A liquid epoxy resin composition which is characterized by containing (A) a liquid epoxy resin, (B) an epoxy adduct curing agent of an amine compound, (C) an inorganic filler, (D) triisopropyl borate and (E) a phenolic resin. This liquid epoxy resin composition is also characterized in that 20-65 parts by mass of the component (C), 0.02-0.15 part by mass of the component (D) and 0.3-15.0 parts by mass of the component (E) are contained per 100 parts by mass of the liquid epoxy resin composition.