Curable resin composition

The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of poly...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ITO, TSUBASA, ISHIKAWA, KAZUNORI, TAKEI, YOSHIHITO, KIM, EMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).