Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution

A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.

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Bibliographische Detailangaben
Hauptverfasser: OISHI, YOSHIYUKI, HISANO, NOBUHARU, KOHAMA, SHINICHIRO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.