Bonding wire and wire bonding method

A bonding wire includes a wire core containing silver (Ag) as a main component and at least one element selected from platinum (Pt), palladium (Pd), rhodium (Rh), osmium (as), gold (Au), and nickel (Ni), and a coating layer of gold (Au) material formed on an outer surface of the wire core.

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Bibliographische Detailangaben
Hauptverfasser:	MOON, JEONG TAK, HONG, SUNG JAE, PARK, CHONG MIN, KIM, SEUNG HYOUN, HEO, YOUNG IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A bonding wire includes a wire core containing silver (Ag) as a main component and at least one element selected from platinum (Pt), palladium (Pd), rhodium (Rh), osmium (as), gold (Au), and nickel (Ni), and a coating layer of gold (Au) material formed on an outer surface of the wire core.