TWI599611B

Provided is a low-viscosity liquid epoxy resin composition from which a cured product with excellent heat resistance can be obtained. This liquid epoxy resin composition is characterized by containing (A) a glycidyl ether compound and (B) a phenolic resin curing agent, and in that the glycidyl ether...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WAKABAYASHI, SHOICHIRO, HARA, MASANAO, TAKIMOTO, SHINICHI, UCHIDA, HIROSHI, OOTANI, KAZUO, DOU, JUN
Format:	Patent
Sprache:	chi
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a low-viscosity liquid epoxy resin composition from which a cured product with excellent heat resistance can be obtained. This liquid epoxy resin composition is characterized by containing (A) a glycidyl ether compound and (B) a phenolic resin curing agent, and in that the glycidyl ether compound (A) is liquid at 25°C and contains substantially no carbon-chlorine bonds, and the phenolic resin curing agent (B) is solid at 25°C.