Under bump metallization structure and method for forming the same and redistribution metallization structure
A structure of an under bump metallization and a method of forming the same are provided. The under bump metallization has a redistribution via hole, viewed from the top, in a round shape or a polygon shape having an angle between adjacent edges greater than 90°. Therefore, the step coverage of the...
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| Hauptverfasser: | , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A structure of an under bump metallization and a method of forming the same are provided. The under bump metallization has a redistribution via hole, viewed from the top, in a round shape or a polygon shape having an angle between adjacent edges greater than 90°. Therefore, the step coverage of the later formed metal layer can be improved. |
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