Laminated body for solder joint and jointed body

The invention provides a laminated body for solder joint. The laminated body for solder joint comprises, in order, a metal nano-particle sintered body layer, a shield layer containing metal particles or metal oxide particles, and a solder joint layer. The invention also relates to a jointed body whi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAWATARI, FUYUMI, YAMASAKI, KAZUHIKO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a laminated body for solder joint. The laminated body for solder joint comprises, in order, a metal nano-particle sintered body layer, a shield layer containing metal particles or metal oxide particles, and a solder joint layer. The invention also relates to a jointed body which comprises, in order, a first jointed body, a laminated body for the above solder joint, and a second jointed body.