Electronic packages and methods of making and using the same

An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer (102) and a conformal masking layer (112) disposed on at least a portion of the dielectric layer (102). The electronic package further includes a routing layer (136) disposed on at l...

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Bibliographische Detailangaben
Hauptverfasser:	FORMAN, GLENN ALAN, KAPUSTA, CHRISTOPHER JAMES, DAVIS, ERIC PATRICK, SMITH, SCOTT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer (102) and a conformal masking layer (112) disposed on at least a portion of the dielectric layer (102). The electronic package further includes a routing layer (136) disposed on at least a portion of the combined masking layer (112) and a micro-via (122) disposed at least in part in the conformal masking layer (112) and the routing layer (136). Further, at least a portion of the routing layer (136) forms a conformal electrically conductive layer (130) in at least a portion of the micro-via (122). Also, the conformal masking layer (112) is configured to define a size of the micro-via (122). The electronic package further includes a semiconductor die (118) operatively coupled to the micro-via (122).