Apparatus of vacuum evaporating

PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus which eliminates the need of consideration of an increment of decrease of conductance in heating a vapor deposition material and allows setting a lower heating temperature for the vapor deposition material.SOLUTION: A vacuum vapor deposition apparatus comprises a plurality of crucibles 2 in which individual vapor deposition materials A are vaporized to form a vaporized material, valves 51 connected to the crucibles 2 in the downstream of the crucibles 2, a diffusion container 21 which introduces the vaporized materials from the valves 51 through introduction tubes 11 and causes the introduced vaporized materials to diffuse and a plurality of nozzles 25 discharging the vaporized materials diffused in the inside 22 of the diffusion container toward a substrate K, and vapor deposition of the substrate K is conducted in a vacuum. None of the introduction tubes 11 has a branched part. The vapor deposition rate is 0.1-10/sec; the thickness (D) of