Rate scalable connector for high bandwidth consumer applications

Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and...

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Bibliographische Detailangaben
Hauptverfasser: MOONEY, STEPHEN R, PEDERSON, BRUCE E, JAUSSI, JAMES E, HECK, HOWARD L
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and the second side of the substrate. A plurality of rows of contacts may be coupled to the first side of the substrate. Each row of contacts can be stacked substantially parallel to the connection edge. The substrate may have power outputs coupled thereto and the integrated buffer can include a voltage regulator that has a supply output coupled to the power outputs.