TWI589433B

The purpose of the present invention is to provide a copper foil with a carrier foil suitable for manufacturing a copper clad laminate for use in laser perforation processing. In order to achieve this purpose, provided is a copper foil with a carrier foil which is equipped with a carrier foil/releas...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TSUYOSHI, HIROAKI, HOSOKAWA, MAKOTO
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a copper foil with a carrier foil suitable for manufacturing a copper clad laminate for use in laser perforation processing. In order to achieve this purpose, provided is a copper foil with a carrier foil which is equipped with a carrier foil/release layer/bulk copper layer layered configuration and which is characterized in that: a roughening-treated layer having a fine uneven structure is provided on both sides of the copper foil with a carrier foil, such structure being formed by needle-shaped or plate-shaped protruded sections which comprise a copper conjugated compound and the maximum length of which is 500 nm or less; the roughening-treated layer provided on the surface of the carrier foil is used as a laser-light-absorbing layer; and the roughening-treated layer provided on the surface of the bulk copper layer is used as an adhesion layer with an insulation layer component.