TWI566049B
The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the com...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | FUKUDA, SHINICHIROH HARIMA, EIJI KONDO, SHINOBU MITANI, TSUYOSHI |
| description | The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI566049BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI566049BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI566049BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfc0NTMzMLF04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADCwbiw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI566049B</title><source>esp@cenet</source><creator>FUKUDA, SHINICHIROH ; HARIMA, EIJI ; KONDO, SHINOBU ; MITANI, TSUYOSHI</creator><creatorcontrib>FUKUDA, SHINICHIROH ; HARIMA, EIJI ; KONDO, SHINOBU ; MITANI, TSUYOSHI</creatorcontrib><description>The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin</description><language>chi</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170111&DB=EPODOC&CC=TW&NR=I566049B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170111&DB=EPODOC&CC=TW&NR=I566049B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUDA, SHINICHIROH</creatorcontrib><creatorcontrib>HARIMA, EIJI</creatorcontrib><creatorcontrib>KONDO, SHINOBU</creatorcontrib><creatorcontrib>MITANI, TSUYOSHI</creatorcontrib><title>TWI566049B</title><description>The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NTMzMLF04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADCwbiw</recordid><startdate>20170111</startdate><enddate>20170111</enddate><creator>FUKUDA, SHINICHIROH</creator><creator>HARIMA, EIJI</creator><creator>KONDO, SHINOBU</creator><creator>MITANI, TSUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20170111</creationdate><title>TWI566049B</title><author>FUKUDA, SHINICHIROH ; HARIMA, EIJI ; KONDO, SHINOBU ; MITANI, TSUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI566049BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2017</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUDA, SHINICHIROH</creatorcontrib><creatorcontrib>HARIMA, EIJI</creatorcontrib><creatorcontrib>KONDO, SHINOBU</creatorcontrib><creatorcontrib>MITANI, TSUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUDA, SHINICHIROH</au><au>HARIMA, EIJI</au><au>KONDO, SHINOBU</au><au>MITANI, TSUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI566049B</title><date>2017-01-11</date><risdate>2017</risdate><abstract>The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi |
| recordid | cdi_epo_espacenet_TWI566049BB |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | TWI566049B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T21%3A06%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUKUDA,%20SHINICHIROH&rft.date=2017-01-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI566049BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |