TWI566049B
The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the com...
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Format: | Patent |
Sprache: | chi |
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Zusammenfassung: | The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin |
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