TWI566049B

The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the com...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUKUDA, SHINICHIROH, HARIMA, EIJI, KONDO, SHINOBU, MITANI, TSUYOSHI
Format: Patent
Sprache:chi
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides a photosensitive resin composition, a dry film, a cured product and a printed wiring board, and in particular provides an alkali development type photosensitve resin composition having excellent development, dryness and punching resistance; a dry film including the composition; a cured product thereof; and a printed wiring board having the cured product. The alkali development type photosensitive resin composition comprises (A) a carboxyl group containing resin, (B) an inorganic filler, (C) a thermosetting component and (D) a photopolymerization initiator, wherein (A) the carboxyl group containing resin comprises (A1) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin having a cresol novolak based backbone), and (A2) a carboxyl group containing resin having a cresol novolak based backbone, or (A3) a carboxyl group containing resin having a phenol-based backbone (however, excludes a carboxyl group containing resin