Power heat dissipation device and heat dissipation control method thereof

Power heat dissipation device and heat dissipation control method thereof

A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG, PO HUA, HWANG, CHIH YU, CHIANG, WEN SHU, LIN, KOU TZENG, WU, MIN CHUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
DYNAMO-ELECTRIC MACHINES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.