Semiconductor device and semiconductor process

Semiconductor device and semiconductor process

The present invention relates to a semiconductor device and semiconductor process. The semiconductor device includes a substrate, a circuit layer, a plurality of under bump metal lurgies (UBMs), a redistribution layer and a plurality of interconnection metals. The substrate has an active surface and...

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Hauptverfasser: OU, YING TE, HUANG, CHE HAU
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator OU, YING TE
HUANG, CHE HAU
description The present invention relates to a semiconductor device and semiconductor process. The semiconductor device includes a substrate, a circuit layer, a plurality of under bump metal lurgies (UBMs), a redistribution layer and a plurality of interconnection metals. The substrate has an active surface and a inactive surface. The circuit layer and the under bump metallurgies (UBMs) are disposed adjacent to the active surface. The redistribution layer is disposed adjacent to the inactive surface. The interconnection metals electrically connect the circuit layer and redistribution layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and semiconductor process
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