TWI549898B

The method involves providing a carrier (1) that comprises a connection layer (2). A resin-coated-copper-foil (3) with electrically conductive regions is applied on an upper side of the connection layer, where the foil comprises two different plies arranged on top of each other. A micro or nano-stru...

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Bibliographische Detailangaben
Hauptverfasser:	BRUENDEL, MATHIAS, HAAG, FRIEDER, SUNDERMEIER, FRIEDER, EHRENPFORDT, RICARDO, KUGLER, ANDREAS, SCHOLZ, ULRIKE
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OR TREATMENT THEREOF MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS,MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES ASDISCRETE UNITS NANOTECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The method involves providing a carrier (1) that comprises a connection layer (2). A resin-coated-copper-foil (3) with electrically conductive regions is applied on an upper side of the connection layer, where the foil comprises two different plies arranged on top of each other. A micro or nano-structured element is applied on an upper side of the foil. The micro or nano-structured element is partially enclosed with an encapsulating compound. A connection of the compound, the micro or nano-structured element and the foil is separated from the connection layer. An independent claim is also included for a semiconductor component comprising a micro or nano-structured element enclosed by an encapsulating compound.