TWI541562B

PROBLEM TO BE SOLVED: To bond substrates to each other while retaining the external shape of an adhesive into a shape of curing.SOLUTION: The method for manufacturing laminated devices includes: applying an adhesive 3 to an inner face of one of a first substrate 1 and a second substrate 2 into a sam...

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Bibliographische Detailangaben
Hauptverfasser: YOKOTA, MICHIYA, HASEGAWA, RYOU
Format: Patent
Sprache:chi
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Zusammenfassung:PROBLEM TO BE SOLVED: To bond substrates to each other while retaining the external shape of an adhesive into a shape of curing.SOLUTION: The method for manufacturing laminated devices includes: applying an adhesive 3 to an inner face of one of a first substrate 1 and a second substrate 2 into a same shape as that in curing; partially semi-curing only a peripheral portion 3a of the adhesive 3 with its retaining viscosity such that the viscosity thereof becomes higher than that of the other portion; and then, bonding the first substrate 1 and the second substrate 2 in such a manner as sandwiching the whole of the adhesive 3 including the peripheral portion 3a. Even when a central portion 3b enclosed with the peripheral part 3a of the adhesive 3 is still in an uncured state, the central portion is dammed by the semi-cured peripheral portion 3a, thus preventing it from developing to the outside.