Apparatus, system, and method for providing a fail-safe communications standard for a power managed sub-fab

Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, the integrated sub-fab system may employ Ethernet and/or RS232 Serial communications through an open platform of apparatus to achieve a reduced carbon footprint during electronic device manufacturing. For this example, the system could include a process tool set and controller linked by sensors or software interconnect with one or more sub-fab or local factory auxiliary systems that can be operated in one or more states of energy consumption. These one or more auxiliary systems can be switched between different levels of energy consumption, as required by the process, via the controller. For many auxiliary components or systems the integrated sub-fab system utilizes existing signal outputs, for others they may employ secondary sensors or monitors.