TWI526316B

Disclosed is a method for eliminating a resin film adhered to a glass plate, said method comprising a heat treatment step for heat treating a resin film adhered upon a glass plate and a washing step for washing away the heat-treated resin film. During the heat treatment step, the surface on the reve...

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1. Verfasser: EBATA, KENICHI
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:Disclosed is a method for eliminating a resin film adhered to a glass plate, said method comprising a heat treatment step for heat treating a resin film adhered upon a glass plate and a washing step for washing away the heat-treated resin film. During the heat treatment step, the surface on the reverse side of the glass plate from the resin film is exposed to the atmosphere at a temperature of 300-450°C, an inert atmosphere at a temperature of 350-600°C or to water vapor at a temperature of 150-350°C.