Pressure sensitive adhesive composition

Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, HYUN CHEOL, JUNG, SA YOUNG, PARK, YONG SU, LEE, DAE HYUCK, KIM, HAK LIM, PARK, HYON GYU, LEE, HUI JE, KWON, YOON KYUNG
Format: Patent
Sprache:chi ; eng
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