Pressure sensitive adhesive composition

Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating sur...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, HYUN CHEOL, JUNG, SA YOUNG, PARK, YONG SU, LEE, DAE HYUCK, KIM, HAK LIM, PARK, HYON GYU, LEE, HUI JE, KWON, YOON KYUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING CALCULATING CHEMISTRY COMPUTING COUNTING CRYPTOGRAPHY DISPLAY DISPLAYING DYES EDUCATION ELECTRIC DIGITAL DATA PROCESSING LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS PHYSICS POLISHES SEALS SIGNS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating surface of a conductive laminate or the like, so that a surface of the conductive laminate or the like can be protected as well as that a peeling force can be maintained appropriately regardless of a peeling rate even after a heat treatment for sintering, and thus can be used for a protective film.