POLISHING PAD AND METHOD FOR MAKING THE SAME

The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantial...

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Bibliographische Detailangaben
Hauptverfasser:	FENG, CHUNG CHIH, SONG, HSIN RU, YAO, I PENG, WU, WEN CHIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.