Copper alloy and copper alloy plate

Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17‰¤f1=[Zn]+5×[Sn]-2×[Ni]‰¤30, 14‰¤f2=[2n]-0.5...

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Bibliographische Detailangaben
Hauptverfasser:	HOKAZONO, TAKASHI, OISHI, KEIICHIRO, NAKASATO, YOSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL ROLLING OF METAL TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17‰¤f1=[Zn]+5×[Sn]-2×[Ni]‰¤30, 14‰¤f2=[2n]-0.5×[Sn]-3×[Ni]‰¤26, 8‰¤f3={f1×(32-f1)} 1/2 ×[Ni]‰¤23, 1.3‰¤[Ni]+[Sn]‰¤2.4, 1.5‰¤[Ni]/[Sn]‰¤5.5, and 20‰¤[Ni]/[P]‰¤400 are satisfied. The copper alloy has a metallographic structure of an ± single phase.