Photosensitive resin composition, cured film, and seperator

The invention relates to a photosensitive compound, a solidifying film and a septum, which can form excellent pattern with size stability even if a thick solidifying film is obtained and will not decrease the volume resistance even if conductive materials like carbon are used as a shielding componen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ITAHARA, TOSHIHIDE, FUJISHIRO, KOICHI, YOSHIOKA, TAKAHIRO, SASAKI, KENRYO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention relates to a photosensitive compound, a solidifying film and a septum, which can form excellent pattern with size stability even if a thick solidifying film is obtained and will not decrease the volume resistance even if conductive materials like carbon are used as a shielding component. The photosensitive compound is characterized in that (i) photo-curing resin and/or photo-curing monomer and (ii) acrylic resin grains are the necessary components, wherein the average once grain size of the (ii) acrylic resin grains is 50 to 200 nm and the weight ratio of the (ii) acrylic resin grains to the (i) photo-curing resin and/or photo-curing monomer is 0.1 to 2.0. Besides, the photosensitive compound is applied to making the solidifying film and the septum.