Application composition for semiconductor element protecting film
Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition...
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| creator | AOBA, KAZUHIRO |
| description | Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide. |
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Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150801&DB=EPODOC&CC=TW&NR=I494387B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150801&DB=EPODOC&CC=TW&NR=I494387B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOBA, KAZUHIRO</creatorcontrib><title>Application composition for semiconductor element protecting film</title><description>Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. 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| language | chi ; eng |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Application composition for semiconductor element protecting film |
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