Application composition for semiconductor element protecting film

Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	AOBA, KAZUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.