Semiconductor structure and semiconductor packaging system

A semiconductor structure ( 100, 900 ) includes a substrate ( 110 ) having a surface ( 111 ) and also includes one or more semiconductor chips ( 120 ) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure ( 340 ) located over the substrate...

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Bibliographische Detailangaben
Hauptverfasser: WETZ, RICHARD W, VISWANATHAN, LAKSHMINARAYAN, CONDIE, BRIAN W
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A semiconductor structure ( 100, 900 ) includes a substrate ( 110 ) having a surface ( 111 ) and also includes one or more semiconductor chips ( 120 ) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure ( 340 ) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads ( 341, 342 ) and an organic-based element ( 343 ) molded to the electrical leads. The semiconductor structure also includes a solder element ( 350 ) coupling together the electrical isolator structure and the substrate surface.