Resin coated copper of the fritting type halogen-free inflammable thermal conductive epoxy binder and manufacturing method thereof

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Bibliographische Detailangaben
Hauptverfasser:	JWO, SHYI LIANG, HUANG, CHI HUA, LAI, CHIEN CHENG, YEH, KUN YEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES
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