Substrate supporting units and substrate treating apparatuses including the same

PURPOSE: A substrate supporting unit and a substrate processing device including the same are provided to uniformly process a substrate by uniformly heating the substrate using a heating member. CONSTITUTION: A heating member includes a first hot wire(231), a second hot wire(232), and a third hot wire(233). The first hot wire is buried in a first region(210a) of a dielectric plate(210). The second hot wire is buried in a second region(210b) of the dielectric plate. The third hot wire is buried in a third region(210c) of the dielectric plate. Heat is transmitted from the first to third hot wires to the substrate via the dielectric plate.