Method of encapsulating optoelectronic components
The method comprises imbedding a component to be encapsulated between a first transparent polymer layer (2) and a second polymer layer, which is filled with non activated foaming agent and subsequently activating the foaming agent so that the polymer layers are welded with one another and the compon...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The method comprises imbedding a component to be encapsulated between a first transparent polymer layer (2) and a second polymer layer, which is filled with non activated foaming agent and subsequently activating the foaming agent so that the polymer layers are welded with one another and the components are embedded between the polymer layers. The foaming agent is a microballoon that consists of polymer membrane that surrounds a drive means. An additional layer is arranged externally on the free side of the first polymer layer and/or the second polymer layer. The method comprises imbedding a component to be encapsulated between a first transparent polymer layer (2) and a second polymer layer, which is filled with non activated foaming agent and subsequently activating the foaming agent so that the polymer layers are welded with one another and the components are embedded between the polymer layers. The foaming agent is a microballoon that consists of polymer membrane that surrounds a drive means. An additiona |
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