TWI462147B

PROBLEM TO BE SOLVED: To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate.SOLUTION: A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MITANI, SHINJO, NITO, MANABU, UTSUGI, HIROSHI, ITO, YASUNORI
Format: Patent
Sprache:chi
Schlagworte:
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