TWI462147B

PROBLEM TO BE SOLVED: To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate.SOLUTION: A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair o...

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Bibliographische Detailangaben
Hauptverfasser: MITANI, SHINJO, NITO, MANABU, UTSUGI, HIROSHI, ITO, YASUNORI
Format: Patent
Sprache:chi
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate.SOLUTION: A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair of laminates are laminated with a first seal material and a second seal material interposed therebetween under reduced pressure. The pair of laminates comprise: a substrate having one or more element formation regions on which an electronic device is formed; and a reinforcement plate detachably bonded to the substrate. The first seal material is arranged in a periphery of the element formation region. The second seal material is arranged outside an aggregation region of the first seal material and has a frame-like shape. The curing step causes the first seal material and the second seal material to cure. The detachment step detaches the reinforcement plate from the substrate.